QUALCOMM INC 325 Profile

747525AU7   96.13  1.00  1.03%   

Performance

0 of 100

 
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Odds Of Default

Less than 41

 
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Below Average
QUALCOMM INC 3.25 percent 20May2027 is a Senior Unsecured Note issued by the corporate entity on the 19th of May 2017. QUALCOMM is trading at 96.13 as of the 28th of November 2024, a 1.03% down since the beginning of the trading day. The bond's open price was 97.13. QUALCOMM has about a 41 percent probability of financial distress in the next few years of operation and has generated negative returns over the last 90 days. Ratings for QUALCOMM INC 325 are calculated daily based on our scoring framework. The performance scores are derived for the period starting the 30th of August 2024 and ending today, the 28th of November 2024. Click here to learn more.

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QUALCOMM Bond Highlights

Business ConcentrationComputers, Electrical Equipment & Parts, Industrials, QUALCOMM INC 325 Corporate Bond, Miscellaneous, Media/Communications, Computing (View all Sectors)
Sub Product AssetCORP
Next Call Date20th of February 2027
Coupon Payment FrequencySemi-Annual
CallableYes
Sub Product Asset TypeCorporate Bond
NameQUALCOMM INC 3.25 percent 20May2027
C U S I P747525AU7
Offering Date19th of May 2017
Coupon3.25
Debt TypeSenior Unsecured Note
I S I NUS747525AU71
Issuer CountryUSA
Yield To Maturity5.291
Price93.33
QUALCOMM INC 325 (747525AU7) is traded in USA.

QUALCOMM INC 325 Risk Profiles

QUALCOMM Against Markets

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Other Information on Investing in QUALCOMM Bond

QUALCOMM financial ratios help investors to determine whether QUALCOMM Bond is cheap or expensive when compared to a particular measure, such as profits or enterprise value. In other words, they help investors to determine the cost of investment in QUALCOMM with respect to the benefits of owning QUALCOMM security.